Tag Archives: PCB

What are acceptability requirements for a board…?

IPC Vice President David Bergman explains new requirements from IPC-A-610 for soldering two boards together.

What are feature location tolerances for rigid flex boards?

IPC Vice President David Bergman discusses use of IPC specifications for manufacturing tolerances and the meaning of producibility levels A, B and C.

Does my company need to start using the new revision of a standard?

IPC Vice President David Bergman answers this online technical question regarding what EMS companies should do about the new revision to IPC-A-610

What are the guidelines for halide content in solder flux?

IPC Vice President David Bergman answers this online technical question from Brazil with reference to J-STD-004

How is IPC-2221 used to calculate insulation requirements?

IPC Vice President David Bergman answers this online technical question and clarifies requirements between conductors and between layers.

Does gold plated solder cup of connector need tinning per J-STD-001?

IPC Vice President David Bergman discusses gold embrittlement and why tinning is necessary per J-STD-001 in this video technical question.

IPC guidance regarding clearance space between components when designing a printed board

Technical Project Manager John Perry explains the clearance information in J-STD-001, IPC-2221 and IPC-7351.

How to make sure you’re using the most recent revision of IPC standards

IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.

Can you use a bare board requirement to reject a completed assembly?

IPC answers the video technical question of the week about rejecting an assembly for a bare board defect under IPC-A-600.

What’s the right tape to use for IPC tape testing requirements?

IPC Director of International Relations Dave Bergman answers the video technical question of the week about tape testing requirements.

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