Tag Archives: J-STD-001

Does gold plated solder cup of connector need tinning per J-STD-001?

IPC Vice President David Bergman discusses gold embrittlement and why tinning is necessary per J-STD-001 in this video technical question.

IPC guidance regarding clearance space between components when designing a printed board

Technical Project Manager John Perry explains the clearance information in J-STD-001, IPC-2221 and IPC-7351.

Where are guidelines for take action limits when using lead free solder found?

Jack Crawford discusses industry concerns about take action limits with lead free solders and where they are found in IPC standards.

What do IPC standards say about acceptability of solder balls?

Technical Question of the Week: What do IPC standards say about acceptability of solder balls?

Which IPC standard is the right one to use for determining conformal coating thickness?

Technical Question of the Week: Which IPC standard is the right one to use for determining conformal coating thickness?

What do IPC standards say about measles?

Technical Question of the Week: What do IPC standards say about measles?

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