Industry expert Bob Willis uses the NPL Defect Database to explain the advantages of dipped solder paste in assembling PoP boards.
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Recent Posts
- Wire corrosion
- Cracking on Single-sided Printed Boards
- Package on Package Popcorning
- Plated-Through Hole Damage
- What are the problems I can look out for with crimp terminations?
- Solderability Testing for Bottom Termination Components
- Design pitfalls that can lead to solder shorts during wave solder
- How can I assess bake out and moisture loss for printed boards?
- Using the Water Break Test to Evaluate Surface Cleanliness
- Causes of PCB Delamination
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