Category Archives: Rework

Advantages of solder paste in assembling package-on-package boards

Industry expert Bob Willis uses the NPL Defect Database to explain the advantages of dipped solder paste in assembling PoP boards.

Do IPC standards require solder mask to be green?

IPC Vice President David Bergman explains what IPC-SM-840D says about solder mask.

How to make sure you’re using the most recent revision of IPC standards

IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.

Are the requirements for hot tear in IPC-A-610 too restrictive?

Technical Question of the Week: Are the requirements for hot tear in IPC-A-610 too restrictive?

Revision Changes to IPC-7711 & 7721

Technical Question of the Week: Lead Free Rework

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