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Causes of PCB Delamination

April 25, 2012 – 9:03 pm

Industry expert Bob Willis explains and shows photos of the causes of PCB lamination defects with help from the NPL Defect Database.

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Solder Mask Outgassing

March 21, 2012 – 8:50 pm

Industry expert Bob Willis explains solder mask outgassing defects with the help of the NPL Defect Database.  

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How can I measure conformal coating thickness

February 3, 2012 – 8:57 pm

Industry expert Bob Willis explains the use of “sticky dots” with the help of the NPL Defect Database.  

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What can I do about LGA/QFN Packages “Floating” During Reflow

January 4, 2012 – 10:27 pm

Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints. Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at www.ipcapexexpo.org/defects-webinar. In addition, he will be the featured [...]

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Bob Willis Provides Ideas for Identifying Counterfeit Components

December 2, 2011 – 8:50 pm

Industry expert Bob Willis explains some nondestructive methods for identifying counterfeit components — before they go on your boards. Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at www.ipcapexexpo.org/defects-webinar. In addition, he will be the featured presenter at the NPL Defect Database Clinic [...]

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Explanation of different PoP inspection techniques

October 31, 2011 – 3:23 pm

Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies. Want to hear more? Willis will be speaking at a free webinar on January 12. Registration is coming soon. In addition, he will be the featured presenter at the NPL Defect Database Clinic on the [...]

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What are the causes for solder skips?

September 16, 2011 – 9:29 pm

 Bob Willis looks at the most common reasons for solder skips on surface mount during wave soldering and illustrates how pad length, solder mask thickness and gassing from solder mask and flux will contribute to the problem.   Bob, in conjunction with the National Physical Laboratory Defect Database, will have an on-site clinic at IPC [...]

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Do I need to clean my no-clean assembly?

August 3, 2011 – 8:54 pm

IPC Manager of Assembly Technology Kris Roberson explains how the new IPC-CH-65 may change your views on cleaning. Learn more about IPC-CH-65B.

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How to measure the thermal zone for boards with blind or buried vias.

June 27, 2011 – 4:39 pm

IPC Technical Project Manager John Perry explains how to measure the thermal zone for boards with blind or buried vias using new concepts developed for the IPC-6012 industry standard.

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Pad cratering, drop test failure and suggested solutions for pads and alloys

May 26, 2011 – 7:45 pm

Industry expert Bob Willis uses the NPL Defect Database to explain pad cratering, drop test failure and suggested solutions for pads and alloys. 

Posted in Assembly | Tagged , | Comments (2)
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