This blog has been put together to share the responses to the many technical questions answered by IPC staff each week. To submit your question, send an e-mail to answers@ipc.org.
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Recent Posts
- Causes of PCB Delamination
- Solder Mask Outgassing
- How can I measure conformal coating thickness
- What can I do about LGA/QFN Packages “Floating” During Reflow
- Bob Willis Provides Ideas for Identifying Counterfeit Components
- Explanation of different PoP inspection techniques
- What are the causes for solder skips?
- Do I need to clean my no-clean assembly?
- How to measure the thermal zone for boards with blind or buried vias.
- Pad cratering, drop test failure and suggested solutions for pads and alloys
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