What can I do about LGA/QFN Packages “Floating” During Reflow

Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints.

Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at www.ipcapexexpo.org/defects-webinar.

In addition, he will be the featured presenter at the NPL Defect Database Clinic on the IPC APEX EXPO show floor February 28-March 1, 2012, in San Diego.

Bring board assemblies for examination or process problems for discussion. Inspection equipment will assist in understanding the process problem and suggested solutions.

NEW THIS YEAR! Mini seminars will take place in the booth each day
February 28–29, 11:00 am, 1:00 pm and 3:00 pm
March 1, 11:00 am, 1:00 pm

  • How to conduct dye & pry on area array packages
  • How to test circuit boards for outgassing for FREE
  • How to test component solderability for a few dollars
  • How to monitor PCB solderability for FREE in production

The clinic is organized by IPC & National Physical Laboratory (NPL) and sponsored by Global SMT & Packaging.

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