PCB Delamination and How it Occurs

Industry expert Bob Willis uses the NPL Defect Database to explain how PCB delamination occurs, the impact it has on PCBs and ways to detect where the delamination has occurred.

Solder Stencil Inspection

Industry expert Bob Willis uses the NPL Defect Database to explain the need to inspect the quality and ongoing condition of solder paste stencils.

SMT Adhesive Inspection

Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection.

HiPHoP Explained

Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.

PCB Bowing and Twisting

Industry expert Bob Willis uses the NPL Defect Database to explore techniques to reduce the possibility of board sag.

Wire corrosion

Industry expert Bob Willis uses the NPL Defect Database to explain the outcome of using corrosive flux when soldering wire.

Cracking on Single-sided Printed Boards

Industry expert Bob Willis uses the NPL Defect Database to explain the causes of solder joint cracks in printed boards.

Package on Package Popcorning

Industry expert Bob Willis uses the NPL Defect Database to explain package on package popcorning which could result in open circuits and solder shorts.

Plated-Through Hole Damage

Industry expert Bob Willis uses the NPL Defect Database to explain common causes of damage to plated-through holes.

What are the problems I can look out for with crimp terminations?

Industry consultant and SMT guru Bob Willis troubleshoots the challenges of using crimp terminations using the National Physical Laboratory’s Process Defect Database.

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