How can I measure conformal coating thickness

February 3, 2012 – 8:57 pm

Industry expert Bob Willis explains the use of “sticky dots” with the help of the NPL Defect Database.

Want to hear more? Willis will be the featured presenter at the NPL Defect Database Clinic on the IPC APEX EXPO show floor February 28-March 1, 2012, in San Diego. Bring board assemblies for examination or process problems for discussion. Inspection equipment will assist in understanding the process problem and suggested solutions.

NEW THIS YEAR! Mini seminars will take place in the booth each day
February 28–29, 11:00 am, 1:00 pm and 3:00 pm
March 1, 11:00 am, 1:00 pm

  • How to conduct dye & pry on area array packages
  • How to test circuit boards for outgassing for FREE
  • How to test component solderability for a few dollars
  • How to monitor PCB solderability for FREE in production

The clinic is organized by IPC & National Physical Laboratory (NPL) and sponsored by Global SMT & Packaging.

By Kim Sterling | Posted in Assembly | Tagged , | Leave a Comment

What can I do about LGA/QFN Packages “Floating” During Reflow

January 4, 2012 – 10:27 pm

Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints.

Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at www.ipcapexexpo.org/defects-webinar.

In addition, he will be the featured presenter at the NPL Defect Database Clinic on the IPC APEX EXPO show floor February 28-March 1, 2012, in San Diego.

Bring board assemblies for examination or process problems for discussion. Inspection equipment will assist in understanding the process problem and suggested solutions.

NEW THIS YEAR! Mini seminars will take place in the booth each day
February 28–29, 11:00 am, 1:00 pm and 3:00 pm
March 1, 11:00 am, 1:00 pm

  • How to conduct dye & pry on area array packages
  • How to test circuit boards for outgassing for FREE
  • How to test component solderability for a few dollars
  • How to monitor PCB solderability for FREE in production

The clinic is organized by IPC & National Physical Laboratory (NPL) and sponsored by Global SMT & Packaging.

By Kim Sterling | Posted in Uncategorized | Leave a Comment

Bob Willis Provides Ideas for Identifying Counterfeit Components

December 2, 2011 – 8:50 pm

Industry expert Bob Willis explains some nondestructive methods for identifying counterfeit components — before they go on your boards.

Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at www.ipcapexexpo.org/defects-webinar.

In addition, he will be the featured presenter at the NPL Defect Database Clinic on the IPC APEX EXPO show floor February 28-March 1, 2012, in San Diego.

Bring board assemblies for examination or process problems for discussion. Inspection equipment will assist in understanding the process problem and suggested solutions.

NEW THIS YEAR! Mini seminars will take place in the booth each day
February 28–29, 11:00 am, 1:00 pm and 3:00 pm
March 1, 11:00 am, 1:00 pm

  • How to conduct dye & pry on area array packages
  • How to test circuit boards for outgassing for FREE
  • How to test component solderability for a few dollars
  • How to monitor PCB solderability for FREE in production

The clinic is organized by IPC & National Physical Laboratory (NPL) and sponsored by Global SMT & Packaging.

By Kim Sterling | Posted in Uncategorized | Leave a Comment

Explanation of different PoP inspection techniques

October 31, 2011 – 3:23 pm

Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies.

Want to hear more? Willis will be speaking at a free webinar on January 12. Registration is coming soon. In addition, he will be the featured presenter at the NPL Defect Database Clinic on the IPC APEX EXPO show floor February 28-March 1, 2012, in San Diego.

Bring board assemblies for examination or process problems for discussion. Inspection equipment will assist in understanding the process problem and suggested solutions.

NEW THIS YEAR! Mini seminars will take place in the booth each day
February 28–29, 11:00 am, 1:00 pm and 3:00 pm
March 1, 11:00 am, 1:00 pm

  • How to conduct dye & pry on area array packages
  • How to test circuit boards for outgassing for FREE
  • How to test component solderability for a few dollars
  • How to monitor PCB solderability for FREE in production

The clinic is organized by IPC & National Physical Laboratory (NPL) and sponsored by Global SMT & Packaging.

By Kim Sterling | Posted in Assembly | Leave a Comment

What are the causes for solder skips?

September 16, 2011 – 9:29 pm

 Bob Willis looks at the most common reasons for solder skips on surface mount during wave soldering and illustrates how pad length, solder mask thickness and gassing from solder mask and flux will contribute to the problem.

 

Bob, in conjunction with the National Physical Laboratory Defect Database, will have an on-site clinic at IPC APEX EXPO in San Diego, February 28-March 1. Send your questions in advance of the show to processdefectclinic@ipc.org!

By Kim Sterling | Posted in Assembly | Leave a Comment

Do I need to clean my no-clean assembly?

August 3, 2011 – 8:54 pm

IPC Manager of Assembly Technology Kris Roberson explains how the new IPC-CH-65 may change your views on cleaning.

Learn more about IPC-CH-65B.

By Kim Sterling | Posted in Assembly, Printed Circuit Boards | Leave a Comment

How to measure the thermal zone for boards with blind or buried vias.

June 27, 2011 – 4:39 pm

IPC Technical Project Manager John Perry explains how to measure the thermal zone for boards with blind or buried vias using new concepts developed for the IPC-6012 industry standard.

By Kim Sterling | Posted in Printed Circuit Boards | Tagged , , , , | Comments (2)

Pad cratering, drop test failure and suggested solutions for pads and alloys

May 26, 2011 – 7:45 pm

Industry expert Bob Willis uses the NPL Defect Database to explain pad cratering, drop test failure and suggested solutions for pads and alloys. 

By Kim Sterling | Posted in Assembly | Tagged , | Comments (1)

Problems with Incomplete Reflow on “Intrusive” Solder Joints

April 26, 2011 – 4:52 pm

Generally a reliable solder method, companies can experience problems with incomplete reflow on “intrusive” solder joints, i.e. “pin in paste” or reflow on through hole components. 90% of the time, a faulty profile is the culprit. Check out Bob Willis’s analysis of the phenomenon with illlustrations from the NPL Defect Database.

By Kim Sterling | Posted in Uncategorized | Leave a Comment

Causes of Solder Fillet Lifting

March 18, 2011 – 2:42 pm

While it is not linked directly to solder reliability, solder fillet lifting can be worrisome. Where is it seen? What are its causes? Check out Bob Willis’s analysis of the phenomenon with illlustrations from the NPL Defect Database.

Get your questions answered by Bob Willis in person at the free process defect database clinic at IPC APEX EXPO in April 2011 in Las Vegas. Sponsored by NPL and IPC.

By Kim Sterling | Posted in Assembly, Lead Free | Tagged , | Comments (2)
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