Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to ‘F’ Revisions

Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to include technical advances in SMT components, new criteria for P-style and solder-charged Butt/I terminations, change to void criteria for BGAs, and more.

PCB Delamination and How it Occurs

Industry expert Bob Willis uses the NPL Defect Database to explain how PCB delamination occurs, the impact it has on PCBs and ways to detect where the delamination has occurred.

Solder Stencil Inspection

Industry expert Bob Willis uses the NPL Defect Database to explain the need to inspect the quality and ongoing condition of solder paste stencils.

SMT Adhesive Inspection

Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection.

HiPHoP Explained

Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.

PCB Bowing and Twisting

Industry expert Bob Willis uses the NPL Defect Database to explore techniques to reduce the possibility of board sag.

Wire corrosion

Industry expert Bob Willis uses the NPL Defect Database to explain the outcome of using corrosive flux when soldering wire.

Cracking on Single-sided Printed Boards

Industry expert Bob Willis uses the NPL Defect Database to explain the causes of solder joint cracks in printed boards.

Package on Package Popcorning

Industry expert Bob Willis uses the NPL Defect Database to explain package on package popcorning which could result in open circuits and solder shorts.

Plated-Through Hole Damage

Industry expert Bob Willis uses the NPL Defect Database to explain common causes of damage to plated-through holes.

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